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課程名稱 |
晶片系統封裝
System in Package |
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開課學期 |
101-2 |
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授課對象 |
電機資訊學院 電子工程學研究所 |
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授課教師 |
盧信嘉 |
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課號 |
EEE5025 |
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課程識別碼 |
943 U0270 |
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班次 |
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學分 |
3 |
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全/半年 |
半年 |
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必/選修 |
選修 |
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上課時間 |
星期二6,7,8(13:20~16:20) |
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上課地點 |
電二104 |
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備註 |
總人數上限：50人 |
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Ceiba 課程網頁 |
http://ceiba.ntu.edu.tw/1012sip |
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課程簡介影片 |
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核心能力關聯 |
核心能力與課程規劃關聯圖 |
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課程大綱
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為確保您我的權利,請尊重智慧財產權及不得非法影印
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課程概述 |
Semiconductor IC Packaging/Testing/Assembly/Reliability/Substrates for Embedded Passives/ Electrical/Thermal/Stress Analysis/ Applications of System in Package. |
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課程目標 |
Semiconductor IC Packaging/Testing/Assembly/Reliability/Substrates for Embedded Passives/ Electrical/Thermal/Stress Analysis/ Applications of System in Package. |
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課程要求 |
Integrated circuit design,
analog integrated circuit design
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預期每週課後學習時數 |
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Office Hours |
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指定閱讀 |
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參考書目 |
★ Textbook: Richard K. Ulrich and William D. Brown, “Advanced Electronic
Packaging” 2/e, IEEE Wiley-interscience, 2006. 全華代理
★ References:
1. John H. Lau, C. P. Wang, John L. Prince and Wataru Nakayama, “Electronic
Packaging Design, Materials, Process and Reliability” McGraw Hill, 1998
2. Gilleo, K., “Area Array Packaging Handbook,” McGraw-Hill 2002
3. 邱碧秀，”微統封裝原理與應用,” 滄海書局, 2005
4. Fundamentals of Microsystems Packaging by R.R. Tummala, McGraw Hill, 2001
5. Integrated Passive Component Technology, by R.K. Ulrich and L.W. Schaper,
Wiley, 2003.
6. Introduction to System-on-package, by R.R. Tummala, McGraw Hill, 2008 華通書坊
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評量方式
(僅供參考) |
|
No. |
項目 |
百分比 |
說明 |
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1. |
Homework |
30% |
|
2. |
Midterm exam |
30% |
in-class, open-book, open-note. |
3. |
Final exam |
30% |
in-class, open-book, open-note,
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4. |
Mini-project |
10% |
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週次 |
日期 |
單元主題 |
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第1週 |
2/19 |
SiP overview / Introduction |
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第2週 |
2/26 |
Material and processing technologies for packaging |
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第3週 |
3/5 |
Processing technology and organic material |
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第4週 |
3/12 |
Ceramic material |
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第5週 |
3/19 |
Electrical design |
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第6週 |
3/26 |
Electrical design |
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第7週 |
4/2 |
Thermal considerations |
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第8週 |
4/9 |
Discrete and embedded passives |
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第9週 |
4/16 |
Midterm |
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第10週 |
4/23 |
Integrated Inductors |
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第11週 |
4/30 |
Basic IC assembly |
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第12週 |
5/7 |
Single chip assembly/ Multichip and 3D IC packaging |
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第13週 |
5/14 |
Single chip assembly/ Multichip and 3D IC packaging |
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第14週 |
5/21 |
RF SoP |
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第15週 |
5/28 |
Reliability |
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第16週 |
6/4 |
Mini project presentation |
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第17週 |
6/11 |
Mini project presentation |
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第18週 |
6/18 |
Final Exam |
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